Wafer Mapping / Die Sort

LDT Micro Precision Co., Ltd has achieved breakthrough in ultrafine micro-machining process capability in the design and manufacturing of test probes for wafer sort / mapping. Using our special design equipment, we are able to produce this high performance probes with tight tolerance specification to ensure effective and long lasting application.

Probes needles materials both plated and unplated type are used with diameters from 0.2mm (8mil) to 0.7mm (28mil). We are able to achive ultra fine tip of radius as small as 6 microns.

  • Tungsten
  • Tungsten Rhenium
  • Beryllium Copper
  • Tungsten Carbide
  • Paliney

By applying special developed process(es) we are able to solder and control the “blade” to the probe needle diamention to within 10 microns. The blade finishing can either nickel or gold plate.

Wafer Testing

Blade Probe Pin
Probe Pin