The evolution of smaller and thinner die poses a great challenges to die bonding process especially on how to prevent crack die. Die thickness as delicated as 50 microns making D/A very difficult to optimise the yield.
We collaborated with out Advanced Material Manufacturer to address the specific customer problems and the needs to resolve them.
Combining with LDT’s technical expertise in micro machining, we are able to offer out breakthrough “solution tool” that addressees the urgent needs. We will continue to work hard to improve on the customers products in both quality and reliability thus optimising the yield.