Patented Technology : Filed No : P1-2014704017
We have the solutions
The evolution of smaller and thinner die poses a great challenge to die bonding process especially on how to prevent crack die. Die thickness as delicate as 50 microns and below making D/A very challenging
At LDT Micro Precision Co., Ltd, we have developed a new push up tool that can minimise the impacr on the delicate die curing push up. We are able to “gang” the multi needle symetrically and vary the specifications in relation to the die size while maintaining the shank diameter to the standard of 0.7mm. The tips are spherically polish for durability.